Thin film printheads have sputtered gold film deposited onto a glazed alumina substrate. Film thickness ranges from a few hundred Angstroms to approximately one micron. The conductor pattern is applied using a photo-resistive and subtractive chemical etching technique. The resistor network is a tantalum nitride compound sputtered onto the substrate. Silicone nitride is deposited on top as a protective layer. All material thicknesses are tightly controlled so that resistor tolerances are very small (i.e. +/-3%). With a smaller mass of resistive material, thermal response is usually faster.

Thin film technology is desirable where high resolution and small resistance variation is required. Applications such as graphics and color printing can take advantage of the superior print quality characteristics of thin film printhead technology. Gulton offers both thick film and thin film printhead technology. Speak with a member of our sales engineering group to determine which technology offers the best solution for your printing requirements.